One major feature that kicad lacking is the capability to edit Solder Paste layer.
As parts size shrinks, simply making solder paste equal to pad size in general is not sufficient for manufacturing.
Different part manufacturer may put different recommendation on relationship of pad size and solder paste size. This is especially true for the QFN package where the center heat sink in general needs a low percentage of solder paste coverage to prevent the chip from floating to one side during re-flow process. Also consider the poor flowing characteristic of no-lead solder paste, simply globally shrink the solder paste using other tools won't always work either.
A feature to edit the shape of solder paste of each module in Module editor is needed. It may implemented by using polygon, circle or etc to define the area for solder paste.
This capability exists, at least since 4.0.4 (maybe not when this case was created). One can simply select None for the copper layers and only check F.Paste for technical layers. See the attached screenshot.
This has become standard practice for footprints accepted by librarians over the last 6 months or so.
Is there anything further? In my opinion, this issue can be closed.