I think the bug reporter is talking about being able to define custom
solder paste shapes on a per pad basis (such as windowing in large heat
sink pads) which AFAIK we currently do not support.
On 8/29/2017 7:17 PM, Evan Shultz wrote:
> This capability exists, at least since 4.0.4 (maybe not when this case
> was created). One can simply select None for the copper layers and only
> check F.Paste for technical layers. See the attached screenshot.
>
> This has become standard practice for footprints accepted by librarians
> over the last 6 months or so.
>
> Is there anything further? In my opinion, this issue can be closed.
>
> ** Attachment added: "Untitled.png"
> https://bugs.launchpad.net/kicad/+bug/594088/+attachment/4941084/+files/Untitled.png
>
I think the bug reporter is talking about being able to define custom
solder paste shapes on a per pad basis (such as windowing in large heat
sink pads) which AFAIK we currently do not support.
On 8/29/2017 7:17 PM, Evan Shultz wrote: /bugs.launchpad .net/kicad/ +bug/594088/ +attachment/ 4941084/ +files/ Untitled. png
> This capability exists, at least since 4.0.4 (maybe not when this case
> was created). One can simply select None for the copper layers and only
> check F.Paste for technical layers. See the attached screenshot.
>
> This has become standard practice for footprints accepted by librarians
> over the last 6 months or so.
>
> Is there anything further? In my opinion, this issue can be closed.
>
> ** Attachment added: "Untitled.png"
> https:/
>