KiCad

~sethh/kicad:checklist

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  3. checklist
Last commit made on 2019-11-16
Get this branch:
git clone -b checklist https://git.launchpad.net/~sethh/kicad
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Branch merges

Branch information

Name:
checklist
Repository:
lp:~sethh/kicad

Recent commits

6bb64dd... by Seth Hillbrand

Adding more Eeschema docs

2918228... by Seth Hillbrand

Adding some additional eeschema checklist items

aee0627... by Seth Hillbrand

Adding documentation for proposed release checklist

577fbc6... by jean-pierre charras

PCBNew: fix issue with keepout area in board editor.
Not able to draw a keepout-area on bottom or internal layers.
This was due to a behavior specific to the footprint editor,
not disabled in board editor.

Fixes: lp:1852847
https://bugs.launchpad.net/kicad/+bug/1852847

c5290de... by jean-pierre charras

housekeeping:
Remove not used files:
- markdown2html is not used (we are using "Sundown" tool)
- newstroke_font_without_CJK.cpp is removed.
Due to code optimization the full font works fine without memory issues
-fix also a few very minor compil warnings

f8aea24... by Jeff Young

Be a bit smarter about moving files through a rename.

Don't rely on rebuilding the tree as it collapses all open
directories. Try and follow the file instead.

Fixes: lp:1852431
* https://bugs.launchpad.net/kicad/+bug/1852431

1df7b71... by Ian McInerney

eeschema: Allow labels to rotate on bus unfold

04edc6c... by Fabien Corona

High contrast color for holes in microvias and buried bias

In high contrast mode, the holes of buried vias and microvias were no darkened when not on the active layer.
In high contrast mode, the outer circle of buried vias and microvias were alway darkened.

In high contrast mode, when the selected layer is non visible through-vias are now darkend.

Fixes: lp:1844982
* https://bugs.launchpad.net/kicad/+bug/1844982

a89dc98... by Seth Hillbrand

Eeschema: Tokenize in UTF8

wchar tokenization breaks for wxWidgets on some platfoms.

Fixes: lp:1852595
* https://bugs.launchpad.net/kicad/+bug/1852595

544867c... by jean-pierre charras

ADD: layer stack manager: support of multilayer dielectric between 2 copper layers
This feature is useful for advanced microwave applications.
This is the last missing feature in the board stackup management.