eb8c8b7...
by
"Hendrik v. Raven" <email address hidden>
change pins of RF splitters to passive (#2057)
* change pins of RF splitters to passive
a splitter has no clear direction as they can either be used as power
splitter or as power combiner. Previously input and output ports were
assigned forcing the usage as splitter. As the devices have no active
components all pins (including GND) have been changed to passive.
From the device datasheet (https://www.ti.com/lit/ds/symlink/hdc1080.pdf):
"DAP - Die Attach Pad. Should be left floating."
"The DAP may be soldered to a floating pad on the board, but the
board pad should NOT be connected to GND."
* Sensor_Humidity: HDC1080: rename DNC pins as NC
To match the datasheet.
7dd793d...
by
=?utf-8?q?Roland_G=C3=A4rtner?= <email address hidden>
Fixed STM32F042F*: renamed pin 15 from VSSA to VSS (#2061)
* Fixed reviewers comments and added symbol for thermal pad variant
- Added ", SOIC-8" to the end of the description
- Changed pin text offset to 20mil and shrinked the symbol accordingly
- Removed "?8" from the footprint filter
- Added "-S" to the symbol name to indicate there is no thermal pad
- Added another symbol with an -SP suffix with pin 9 stacked on pin 8 for the thermal pad
* adjusted footprintfilter for -SP variant
* set pad to passive
was violating S4.3 (see special case)
* reduced pin length to 100mil
changed -S variant to SOIC
rearranged the pins to clear the text
* moved vm back to top and rearranged pins for compact size
