The thermal vias had a incorrect layer set.
A check with the python script still reports for a potentially missing
Paste layer for pad 11. The paste pads are separately drawn according to
the datasheet.
be27e46...
by
Philippe Alff <email address hidden>
* RJ12_A.kicad_mod: changed grid origin and added square pad for pin 1
* improved RJ12_A footprint
fixed fab and silkscreen reference placement, added fab outline, description, search words
* improved RJ12_A footprint
fixed footprint location with respect to origin, exact pin spacing
* fixed RJ12_A courtyard
* Update and rename RJ12_A.kicad_mod to RJ12_YT2038Y_Horizontal.kicad_mod
also updated descripton of RJ12_YT2038Y_Horizontal
* fixed RJ12_YT2018Y_Horizontal footprint issues
moved silkscreen outline to not overlap with fab outline;
changed connection pad diameter to 0.9mm;
added pin 1 indicator on silkscreen layer;
added path for 3D model
* Update and rename RJ12_YT2038Y_Horizontal.kicad_mod to RJ25_Wayconn_MJEA-660X1_Horizontal.kicad_mod